Application and production method of spherical quartz powder

Overview of Spherical Quartz SiO2 Powder

Spherical quartz powder has excellent properties such as smooth surface, large specific surface area, high hardness and stable chemical properties. First of all, the spherical powder has good fluidity and is uniformly mixed with the resin to form a film. The resin addition is small, the quartz powder filling amount is high, and the mass fraction can reach up to percent 90.5. The higher the filling amount of quartz powder, the lower the thermal conductivity, and the smaller the thermal expansion coefficient of the molding compound. The closer to the thermal expansion coefficient of monocrystalline silicon, the better the performance of the electronic components produced. Secondly, the stress of the spherical powder is only 60 percent of the stress of the angular powder, and the plastic molding compound made of spherical quartz powder has the least stress concentration and the highest strength. Finally, the spherical powder has a smooth surface, low friction coefficient, and low wear on the mold, which can prolong the service life of the mold by more than one time.

Application of spherical quartz SiO2 powder

Spherical quartz powder has a wide range of applications, and its use as an electronic packaging material is the largest market for its application. Electronic packaging is the supporting industry of integrated circuits. With the development of large-scale and ultra-large-scale integrated circuits, integrated circuits are becoming more and more sophisticated, and the requirements for packaging materials are getting higher and higher, and packaging forms are continuously optimized and updated. The three main materials of electronic packaging are substrate materials, plastic packaging materials, lead frames and solders. Due to its low cost, simple process, and suitable for mass production, plastic packaging has developed rapidly since its birth, and its share of packaging has become larger and larger. At present, plastic packaging accounts for percent of the integrated circuit market in the world. above 95. Among the plastic packaging materials, epoxy plastic packaging materials (EMC) are the mainstream of integrated circuit packaging at home and abroad, and microelectronic components above percentage 95 use epoxy plastic packaging.

In microelectronics packaging, the main requirements are high moisture resistance, low stress, low alpha radiation, resistance to dip soldering and reflow soldering, and good plastic packaging performance after the integrated circuit is packaged. In response to this, the epoxy molding compound must be doped with inorganic fillers in the resin matrix. Almost all inorganic fillers currently used are quartz micropowder (silica micropowder). With the rapid development of the microelectronics industry, large-scale and ultra-large-scale integrated circuits have increasingly higher requirements for packaging materials. As an important support material for EMC, quartz powder not only requires its particle size to meet the specific range of packaging, but also requires its purity High, low content of radioactive elements, especially for the shape of the particles put forward the requirements of spheroidization.

Spherical silicon powder not only has good shape, but also has high chemical purity and low content of radioactive elements. It can meet the technical requirements of high-end integrated circuits. Its application can greatly reduce the thermal expansion coefficient of the plastic packaging compound, reduce its dielectric constant, and reduce stress. The earth enhances the rigidity, abrasion resistance, weather resistance, impact resistance, compression resistance, tensile resistance, moisture resistance, and flame resistance of the product, so that the product has good arc resistance insulation characteristics and resistance to ultraviolet radiation, etc., and has become an electronic package Indispensable key material. In addition to being mainly used in the field of electronic packaging, spherical quartz powder can also be widely used in the manufacture of electronic inks, optical fibers, high-grade cosmetics, high-grade precision ceramics, precision grinding of optical devices and electronic components, and as fillers for special paints and coatings. .

Spherical quartz SiO2 powder production method

Spherical quartz powder is purified and ultra-finely crushed from natural quartz stone, and then passes through a certain high temperature field to make its phase, crystal and shape change instantaneously, from a solid state to a molten state to a solid state, and from a crystalline state to a solid state. Amorphous state, a powder obtained from irregular angular particles into regular spherical particles. Its preparation methods currently generally include high temperature plasma melting method, high temperature melting spray method and gas combustion flame method.

High temperature plasma melting

The high-temperature plasma melting method uses the high-temperature gas generated by the AC or DC arc plasma as the heat source to spray quartz powder into the plasma flame. The powder is heated and melted and instantly vaporized, then quenched, and collected by a cyclone and a cloth bag. The spherical silicon powder is obtained. It is characterized by high heating temperature, which can obtain a temperature field that is more than 5 times higher than chemical combustion (above 3000K). High temperature, high heat and high active atmosphere make the chemical reaction proceed very quickly, resulting in the rapid formation of high temperature phase compounds that are difficult to synthesize by chemical liquid phase method. (Such as nitrides, carbides and borides, etc.); when the reaction material leaves the plasma, the particles will no longer grow after rapid cooling; the plasma state of different atmospheres can be formed according to different needs, and the range of reactants is wide.

However, plasma technology is very difficult. First, the plasma temperature field is affected by the magnetic and electrical properties of the plasma. The temperature field is small and concentrated. The stable high temperature field of the heating device is not easy to control, and the temperature range is not easy to adjust; secondly, the plasma energy The generation of the water jet is realized by the current passing through the ionized gas medium. Too much dilution of the plasma will interrupt the current and lose its effect. These factors make it difficult to control the spheroidization rate of the product, and it is difficult to form large-scale production.

High temperature melt jet

The high-temperature melt injection method is to put the material in a high-temperature field to melt it into a melt. At the moment the melt flows out, it is sprayed with high-pressure air through the ejector, and the melt is dispersed and broken into mist by the high-speed airflow. The small droplets are rapidly cooled again, and the small droplets naturally shrink quickly and naturally into spherical particles with a smooth surface when they are cold. The high temperature melt spray method is the easiest method to ensure spheroidization and amorphous rate. However, a series of key technologies such as furnace high temperature materials, viscous quartz melt atomization and prevention of secondary pollution have not broken through, and it is very difficult to manufacture high-purity spherical quartz powder.

Gas combustion flame method

The gas combustion flame method uses acetylene, hydrogen, natural gas and other fuel gases as raw materials, and uses oxygen or air as supporting gas to produce a clean flame through the combustion of a closed furnace. At the same time, the angular quartz powder is transported into the flame along with the airflow. When the angular powder passes through the high-temperature flame field, it is first melted into amorphous particles. When it leaves the high-temperature field and is rapidly cooled, it immediately shrinks into spherical particles, and then is collected by the cyclone to obtain the finished product. This method involves theories of thermodynamics, gas and particle fluid dynamics. Compared with plasma high-temperature flames, firstly the temperature field is relatively low, and secondly, there are fewer influencing factors. It no longer involves the theory of electromagnetics and the flow of ions in the electromagnetic field. The problem of movement makes it easier to control various conditions affecting factors, equipment manufacturing is more simplified, industrialization is easier, and development prospects are better.

Spherical quartz SiO2 powder price

The price of spherical quartz powder balls will vary randomly with the production cost, transportation cost, international situation, and the market supply and demand of spherical quartz powder balls. Tanki New Materials Co., Ltd. aims to help various industries and chemical wholesalers find high-quality products. Provide high-quality, low-cost nanomaterials and chemicals, and provide a full set of customized services. If you are looking for spherical quartz powder spherical, please feel free to send an inquiry to get the latest price

Spherical Quartz SiO2 Powder Ball Supplier

As a global supplier of spherical quartz powder balls, Tanki New Materials Co., Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials (titanium oxide, silicon oxide, titanium oxide, etc.), high-purity targets, functional ceramics and structural devices, and provides OEM services.