Current Status and Future Development Trend of Aluminum Nitride (AlN) Ceramic Substrate Market

Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.

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Because aluminum nitride has excellent thermal, electrical and mechanical properties. Aluminum nitride ceramics have attracted widespread attention from researchers at home and abroad. With the rapid development of modern science and technology, higher requirements have been placed on the properties of the materials used. Aluminum nitride ceramics will also be more widely used in many fields! Despite the unremitting efforts of many researchers over the years, great progress has been made in the research of powder preparation, forming, and sintering. However, as of April 2013, the commercialization of aluminum nitride is not high, which is also a key factor affecting the further development of aluminum nitride ceramics. In order to promote the further development of aluminum nitride research and application, the following two research tasks must be done. Research low-cost powder preparation technology and methods! The main factor restricting the commercialization of aluminum nitride is the price issue. If aluminum nitride powder can be prepared at a lower cost, its commercialization will be greatly improved! High-temperature self-propagating method and low-temperature carbothermic reduction synthesis process are promising powder synthesis methods. Both have the characteristics of low cost and suitable for large-scale production! Research on the net near forming technology of complex-shaped aluminum nitride ceramic parts, such as injection molding technology. It is of great significance to give full play to the performance advantages of aluminum nitride and broaden its application range.

Overview of Aluminum Nitride Ceramic Powder

Aluminum Nitride Ceramic (Aluminum Nitride Ceramic) is a ceramic with aluminum nitride (AIN) as the main crystal phase.

AIN crystals are covalently bonded compounds with 〔AIN4〕 tetrahedron as the structural unit, which has a wurtzite-type structure and belongs to the hexagonal crystal system. Chemical composition AI percent 65.81, N percent 34.19, specific gravity 3.261g/cm3, white or off-white, colorless and transparent single crystal, sublimation decomposition temperature under normal pressure is 2450℃. It is a high-temperature heat-resistant material. Coefficient of thermal expansion (4.0-6.0) X10-6/℃. The thermal conductivity of polycrystalline AIN is 260W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat at 2200℃. In addition, aluminum nitride has the characteristics of not being corroded by molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum.

Aluminum nitride has the characteristics of not being corroded by molten aluminum, other molten metals and gallium arsenide, and especially has excellent corrosion resistance to molten aluminum.

AlN can be stabilized to 2200°C. The strength is high at room temperature, and the strength decreases slowly as the temperature rises. It has good thermal conductivity and low thermal expansion coefficient, making it a good thermal shock material. It has a strong ability to resist corrosion of molten metal and is an ideal crucible material for smelting and casting pure iron, aluminum or aluminum alloy.

Application of Aluminum Nitride Ceramic Powder

1. Aluminum nitride powder has high purity, small particle size and high activity. It is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.

2. Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal substrate and packaging material for large-scale integrated circuits.

3. The hardness of aluminum nitride is higher than that of traditional alumina. It is a new type of wear-resistant ceramic material, but due to its high cost, it can only be used on severely worn parts.

4. Utilizing the heat resistance, melt erosion resistance and thermal shock resistance of AlN ceramics, it can be made into GaAs crystal crucibles, Al evaporation plates, magnetic fluid power generation devices and high-temperature turbine corrosion-resistant parts, and its optical properties can be used as infrared window. Aluminum nitride film can be made into high-frequency piezoelectric components and ultra-large-scale integrated circuit substrates.

5. An aluminum nitride is heat-resistant, resistant to molten metal corrosion, stable to acid, but easily corroded in alkaline solutions. When exposed to humid air, the new surface of AIN will react, forming a very thin oxide film. Using this feature, it can be used as a crucible and mold material for smelting metals such as aluminum, copper, silver, and lead. AIN ceramics have good metallization properties and can replace toxic beryllium oxide ceramics in the electronics industry.

Aluminum nitride ceramic powder price

The price of aluminum nitride ceramic powder will change randomly with factors such as production cost, transportation cost, international situation, exchange rate, and market supply and demand of aluminum nitride ceramic powder. Tanki New Materials Co., Ltd. aims to help various industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemicals by providing a full set of customized services. If you are looking for aluminum nitride ceramic powder, please feel free to send an inquiry to get the latest price of aluminum nitride ceramic powder.

Aluminum Nitride Ceramic Powder Supplier

As a global supplier of aluminum nitride ceramic powder, Tanki New Materials Co., Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced and engineered materials. The company has successfully developed a series of powder materials (molybdenum disilicide, lanthanum nitride LaN powder, calcium silicide, iron boride), high-purity targets, functional ceramics and structural devices, and provides OEM services.

AlN Ceramic Powder Injection Molding Components Properties
Other Names Aluminium nitride
CAS No. 24304-00-5
Compound Formula AlN
Molecular Weight 40.9882
Appearance White to pale yellow powder
Melting Point 2200 °C
Boiling Point 2517 °C (dec.)
Density 2.9 to 3.3 g/cm3
Solubility in H2O N/A
Electrical Resistivity 10 to 12 10x Ω-m
Poisson's Ratio 0.21 to 0.31
Specific Heat 780 J/kg-K
Thermal Conductivity 80 to 200 W/m-K
Thermal Expansion 4.2 to 5.4 µm/m-K
Young's Modulus 330 GPa
Exact Mass 40.9846
Monoisotopic Mass 40.9846
AlN Ceramic Powder Injection Molding Components Health & Safety Information
Remarks Danger
Hazard Statements H314-H335
Hazard Codes Xi
Risk Codes 36/37/38
Safety Statements 26-37/39
RTECS Number N/A
Transport Information N/A
WGK Germany 3

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