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Tantalum Nitride Properties
Tantalum nitride is a black hexagonal crystal. The relative density is 13.4; the melting point is 3090℃; the microhardness is 110kg/m2; the thermal conductivity is 9.54W/(m.K). Resistivity 128u. cm. δ tantalum nitride is a yellow-green crystal, a sodium chloride crystal, with a relative density of 15.6. Character constant α=0. 4336nm, c-0.4150nm, melting point 2950℃, microhardness 3200kg/mm2, transformation point temperature 17.8K. Insoluble in water and acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decomposed to release ammonia. Nitrogen is released when heated to 2000°C.
Tantalum Nitride Method
The metal tantalum powder is directly nitridated with ammonia or nitrogen at about 1100°C.
Overview of tantalum nitride TaN powder
Tantalum Nitride TaN powder is a chemical material with a molecular formula of TaN and a molecular weight of 194.95. Materials used to make precision sheet resistors resistant to water vapor. In the integrated circuit manufacturing process, these thin films are deposited on top of silicon wafers to form thin-film surface-mount resistors. Nitride tantalum TaN powder is a black hexagonal crystal with a relative density of 13.4, a melting point of 3090°C, a microhardness of 1100kg/mm2, a thermal conductivity of 9.54W/(m•K), and a resistivity of 128μΩ•cm.
Tantalum Nitride TaN powder is a sodium chloride type yellow-green crystal, with a relative density of 15.6, a lattice constant of A=0.4336nm, C=0.4150nm, a melting point of 2950℃, a microhardness of 3200kg/mm2, and a transition point temperature of 17.8K.
It is insoluble in water and acid, slightly soluble in aqua regia, and soluble in potassium hydroxide. It is separated to liberate ammonia, and it is heated to 2000°C to liberate nitrogen.
Application of tantalum nitride TaN powder
The material used to make precision chip resistors, tantalum nitride resistors can resist the erosion of water vapor.
Used as a superhard material additive to prepare pure tantalum pentachloride: used for spraying to increase the electrical stability of transformers, integrated circuits and diodes
Tantalum Nitride TaN powder is sometimes used in integrated circuit manufacturing to form a diffusion barrier or "glue" layer between copper or other conductive metals. In the case of BEOL processing (approximately 20 nm), the copper is first covered with tantalum, and then TaN is coated by physical vapor deposition (PVD). Before machining (grinding/polishing), more copper is applied to the barrier coating by PVD, and then electrolytic coating is filled on it.
Tantalum Nitride TaN powder is also suitable for thin film resistors. Compared with nickel-chromium resistors, it has the advantage of forming a moisture-proof passivation oxide film.
Nitride tantalum TaN powder can be used as an additive for superhard materials to produce pure tantalum pentachloride, which can be used for spraying and improving the electrical stability of transformers, integrated circuits and diodes.
The price of tantalum nitride TaN powder
The price of tantalum nitride TaN powder will vary with the production cost, transportation cost, international situation, exchange rate and supply and demand of tantalum nitride tan powder randomly. Tanki New Materials Co., Ltd. aims to help various industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemical products by providing a full set of customized services. If you are looking for tantalum tantalum nitride powder, please feel free to send an inquiry to get the latest price of tantalum tantalum nitride powder.
Tantalum Nitride and Tantalum Powder Suppliers
As a global supplier of vanadium and tantalum nitride powder, Tanki New Materials Co., Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials such as molybdenum disilicide, lanthanum nitride (LaN powder, calcium silicide, iron boride), high-purity target materials, functional ceramics and structural devices, and provides OEM services.
| Tantalum Nitride Properties | |
| Other Names | Tantalum mononitride, azanylidynetantalum, nitridotantalum, |
| Nitrilotalanlum | |
| CAS No. | 12033-62-4 |
| Compound Formula | TaN |
| Molecular Weight | 194.95 |
| Appearance | Black Powder |
| Melting Point | 3090 ℃ |
| Boiling Point | N/A |
| Density | 13.4 g/cm3 |
| Solubility in H2O | N/A |
| Exact Mass | 194.95458 g/mol |
| Tantalum Nitride Health & Safety Information | |
| Signal Word | N/A |
| Hazard Statements | N/A |
| Hazard Codes | NDS 69,209 (1993) |
| Risk Codes | stable |
| Safety Statements | 3/2- |
| Transport Information | 7452.8 10 |
