Overview of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

This product is an aluminum nitride ceramic sheet with copper coating bonded using active metal brazing. Aluminum nitride ceramic is the base material. It handles very high temperatures well. It also conducts heat extremely effectively. This makes it ideal for demanding electronics needing heat removal. The ceramic itself is electrically insulating. This prevents short circuits.

A layer of copper is permanently bonded onto the ceramic surface. Active metal brazing makes this bond. This process creates a strong, reliable connection. The copper layer spreads heat quickly. Copper is excellent at conducting heat. The bonded copper layer allows direct soldering. Components mount easily onto the copper surface. This creates efficient thermal paths.

The copper coating is dense and uniform. Good adhesion is critical. The active metal brazing ensures this. This prevents the copper from peeling off. The ceramic remains stable under thermal stress. This combination offers high thermal conductivity. It also provides strong electrical isolation. The material withstands thermal cycling reliably. This means repeated heating and cooling won’t damage it.

These sheets come in various sizes. Thickness options exist for different needs. The copper coating thickness can be specified. Surface finishes are available too. Common finishes include bare copper or protective finishes. This protects the copper before use.

This material suits power electronics perfectly. It works well in high-power LED modules. RF microwave packages benefit from it. Electric vehicle power systems use it. Laser diode carriers need this performance. Any application needing fast heat removal from hot components uses this. It moves heat away from critical parts efficiently. This improves device performance and lifespan.

Applications of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

Active metal brazing AMB copper coated aluminum nitride ceramic sheets solve tough problems. These AlN substrates are special. Aluminum nitride moves heat away fast. It keeps things cool. Copper coating on the AlN provides a strong electrical path. The AMB process bonds the copper layer firmly to the ceramic. This bond survives extreme heat cycles. It lasts a long time.

Power electronics need this material. Electric vehicles use lots of power. Their inverters and motor controllers get very hot. This AlN substrate moves the heat out. It stops parts from failing. Renewable energy systems work the same way. Solar inverters and wind power converters rely on this cooling. The strong AMB bond is key. It handles the power surges and temperature swings.

High-power radio frequency and microwave devices need AlN. Base stations for phones and radar systems push signals hard. They generate intense heat. Aluminum nitride moves this heat efficiently. The copper layer connects the circuits cleanly. Signal loss stays low. Performance stays high.

Industrial lasers demand robust materials. Their pump diodes and laser bars create enormous heat. AlN substrates manage this thermal load. The copper coating provides stable mounting. The AMB bond ensures everything stays put. This is vital for reliable, long-lasting laser operation.

High-brightness LED lighting pushes limits too. These LEDs pack immense power into tiny spaces. Heat builds up fast. AlN substrates pull the heat away effectively. This prevents the LEDs from dimming early. It protects the light quality.

Sensors and detectors in harsh environments use this material. Oil and gas exploration equipment faces extreme conditions. Aerospace systems need absolute reliability. This AlN substrate handles the heat and vibration. The copper coating ensures solid electrical connections. The AMB process guarantees the assembly holds together.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

What is this AMB copper-coated Aluminum Nitride sheet?
It’s a special ceramic base material. Aluminum Nitride (AlN) ceramic forms the core. A copper layer bonds tightly to both sides. We use Active Metal Brazing (AMB) to attach the copper. AMB creates a strong, reliable connection between the ceramic and the metal.

Why choose AMB for coating AlN ceramic?
AMB solves a big problem. Aluminum Nitride ceramic is hard to bond with metals normally. The AMB process uses special elements. These elements react with the ceramic surface. This reaction makes a solid chemical bond. The bond is very strong. It handles high temperatures and thermal cycling well. Other methods struggle to achieve this.

What are the main benefits of this material?
This material carries heat very well. Aluminum Nitride ceramic itself is excellent at heat transfer. Adding the thick copper layer boosts this further. Copper spreads heat fast. The AMB bond is strong and reliable. This combination provides outstanding thermal management. It also handles high electrical power. The copper layers allow easy soldering of electronic parts.

Where is this AMB AlN sheet typically used?
You find it where heat is a big problem. Power electronics use it heavily. Think electric vehicles, industrial motor drives, renewable energy systems. It’s perfect for power modules needing to cool high-power semiconductors like IGBTs or SiC devices. High-brightness LED packages rely on it. RF/microwave packages use it too. Any application needing extreme heat spreading and electrical insulation uses this material.

How does AMB AlN differ from other metallized ceramics?
It handles more power. Direct Bonded Copper (DBC) on Alumina or AlN is common. AMB AlN bonds thicker copper layers. Thicker copper carries more current and spreads heat better. The AMB bond strength is higher than standard DBC bonds. This strength is crucial for tough environments with big temperature swings. AMB AlN offers better thermal performance than AMB Alumina.