Overview of Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates

Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates

Our factory produces high purity aluminum nitride specifically for incorporated circuit substrates. We make certain the product fulfills rigorous requirements for innovative electronics applications. The light weight aluminum nitride powder attains pureness levels exceeding 99.9%. This lessens unwanted contaminations that could influence circuit performance. Key metal impurities like sodium, potassium, iron are maintained exceptionally low. This high purity is necessary for trustworthy semiconductor manufacturing.

The product supplies exceptional thermal conductivity. Its thermal conductivity ranking is high, typically over 170 W/mK. This home is essential because IC substrates should dissipate warmth efficiently. Good thermal administration avoids tool getting too hot and failing. Light weight aluminum nitride additionally gives solid electric insulation. Its dielectric toughness is very high. This prevents electric leak between circuit elements. The dielectric constant is stable over a broad regularity range.

Light weight aluminum nitride substratums have excellent mechanical toughness. They are robust enough to stand up to handling and processing stress and anxieties. The material is compatible with standard thin-film deposition methods. Surface area top quality is critical for fine-line circuitry. Our substrates feature an extremely smooth, defect-free surface finish. This allows specific photolithography pattern. We provide substratums in numerous basic dimensions and thicknesses. Custom measurements are likewise available based upon certain job demands.

All our high pureness aluminum nitride undergoes rigorous quality control. We test each batch for pureness, thermal residential properties, and electric qualities. The material is packaged meticulously to avoid contamination or damage throughout shipping. We support the demanding demands of the semiconductor industry.

Applications of Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates

Manufacturing facility high purity Light weight aluminum Nitride (AlN) is an essential product for incorporated circuit substratums. ICs generate considerable warm during operation. This warmth needs to be eliminated effectively. AlN substrates succeed here. They possess excellent thermal conductivity. Warm actions away from the chip promptly. This stops getting too hot. Overheating can damage parts or lower performance.

Thermal expansion is one more vital factor. AlN substratums have a thermal development coefficient close to silicon chips. Silicon is the main material for ICs. When temperature level modifications, both products increase or shrink similarly. This avoids anxiety build-up. Anxiety can break chips or break links. AlN helps keep whatever stable.

Electric insulation is important for substratums. AlN is a strong electric insulator. It stops unwanted current flow in between circuit parts. This preserves signal stability. Signals stay tidy and precise. High pureness AlN minimizes electric losses. Efficiency stays high.

AlN substratums are extremely secure. They handle heats well. They stand up to chemical corrosion efficiently. This makes sure long-term dependability. Gadget last much longer under hard conditions. They provide much better efficiency than older products like alumina. Alumina has reduced thermal conductivity. AlN supplies a considerable upgrade for requiring electronic devices. Its residential or commercial properties make it suitable for modern, high-power ICs.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Factory High Purity Aln Aluminum Nitride for Integrated Circuit Substrates

What makes Factory High Purity Aln Aluminum Nitride good for Integrated Circuit Substrates?

Integrated circuits create heat. Heat needs to escape fast. Factory High Purity Aluminum Nitride moves heat away well. This keeps chips cooler. Cooler chips work better and last longer. Its thermal conductivity is high. It is much better than alumina.

How does the thermal conductivity of Aluminum Nitride compare to other ceramics?

Aluminum Nitride moves heat faster than alumina. Alumina is common. Aluminum Nitride moves heat much better. This is critical for modern electronics. Electronics get hotter as they get smaller and more powerful. Good heat removal is essential. Aluminum Nitride provides this.

Why is surface smoothness important for these substrates?

Integrated circuit substrates hold thin layers. These layers form the circuits. The surface must be very smooth. A smooth surface lets layers stick well. It also allows precise patterning. Rough surfaces cause defects. Defects ruin circuit performance. Factory High Purity Aluminum Nitride substrates are polished smooth. This ensures reliable circuit building.

How does purity level affect Aluminum Nitride performance?

Impurities block heat flow. Impurities weaken the material. Factory High Purity Aluminum Nitride has very few impurities. This means heat moves freely through it. The material stays strong under stress. High purity equals better thermal management. Better thermal management protects the delicate circuits on top.

Can Aluminum Nitride substrates handle repeated heating and cooling?

Electronic devices turn on and off. They heat up and cool down constantly. The substrate material must handle this stress. Aluminum Nitride handles thermal cycling well. Its thermal expansion rate is low. It expands and contracts less than some other ceramics. This reduces stress on the circuits attached to it. Less stress means fewer failures. The substrate stays reliable over time.