Overview of Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

This thermal pad substrate uses aluminum nitride material. It is designed for cooling power electronics like MOS transistors and IGBTs. The material choice is critical. Aluminum nitride offers very high thermal conductivity. This means it moves heat away from hot components fast. Good heat transfer keeps electronics running cooler and more reliably. Electrical insulation is another key feature. Aluminum nitride does not conduct electricity. This prevents short circuits between the component and the heatsink. Safety and proper function depend on this insulation.

The substrate comes with holes pre-drilled. These holes allow for mounting screws or bolts. Secure attachment to the heatsink is important. Good contact ensures efficient heat flow. The hole pattern is precise. It matches standard mounting layouts for common power modules. This simplifies installation. The aluminum nitride material is also wear-resistant. It withstands physical stress during handling and assembly. Long-term performance is not compromised by surface damage.

Thermal conductivity is a major specification. Values are typically high, often exceeding 170 W/mK. This performance is consistent across a wide temperature range. Electrical insulation withstands high voltages. Breakdown ratings are impressive, often thousands of volts. The material handles extreme heat. Operating temperatures can reach very high levels, sometimes over 800°C. Mechanical strength is good. The substrate resists cracking and chipping. Dimensions are tightly controlled for a perfect fit. Surface finish is smooth. This promotes maximum contact area with the heatsink. Thermal interface material application is easy on this surface. Aluminum nitride is chemically stable. It doesn’t react with common coolants or thermal pastes. This pad substrate is a solid solution for demanding cooling jobs.

Applications of Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

This thermal pad substrate uses Aluminum Nitride material. It helps cool electronics in factories. Electronics like MOS transistors and IGBTs get very hot. Heat can damage them or make them fail. This AlN pad pulls heat away. It spreads the heat out fast. The Aluminum Nitride material works well for this. It moves heat quickly. It doesn’t break down easily. It stays strong under high temperatures. Factories need tough parts. This pad is built tough. It handles harsh factory conditions. The pad has holes through it. These holes are important. Screws or bolts go through these holes. You attach the pad tightly to the electronics. You also attach it tightly to the cooling surface. Good contact is needed. Good contact moves heat better. Without good contact, cooling suffers. The holes help get this tight fit. This setup protects sensitive parts. Power supplies and motor controls use these parts. These areas see heavy use. They need reliable cooling. The AlN pad provides that cooling. It keeps power levels stable. It stops components from overheating. This means less downtime for repairs. Factories save money and time. Industrial machines last longer. Production lines run smoother. The pad works in electric cars too. It helps manage heat in power converters. It works well in solar power systems. Wind turbines also use this technology. Anywhere strong electronics work hard, this cooling pad helps. It moves heat efficiently. It handles the tough factory life.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

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T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Factory Wear Resistance MOS Transistor IGBT Aln Aluminum Nitride Thermal Pad Substrate for Cooling Pad with Hole

What is this thermal pad for? It helps cool MOS transistors and IGBTs in factory settings. These parts get hot during use. Heat can damage them. This pad moves heat away quickly. It keeps parts working safely.

Why use aluminum nitride? Aluminum nitride moves heat very well. It moves heat better than many other materials. Aluminum nitride handles high temperatures too. It does not crack easily under heat stress. This makes it reliable for tough factory conditions.

What does the hole do? The hole lets you mount the pad onto cooling systems. You can bolt it down tight. This ensures good contact between the pad and the cooler. Good contact means heat moves efficiently. Without the hole, mounting could be less secure.

How does it resist wear? The aluminum nitride material is very hard. It withstands physical wear from vibration and friction in machinery. This pad lasts longer than softer materials. You won’t need to replace it as often. It saves time and money.

How do I install it? Clean the surfaces of the transistor and the cooler first. Apply thermal paste thinly on both sides of the pad. Place the pad between the transistor and the cooler. Line up the mounting hole. Secure it firmly with the bolt. Tighten it properly for good heat transfer.