Overview of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate

Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate

This Aluminum Nitride (AlN) ceramic substrate offers outstanding heat management. Its core strength lies in exceptional thermal conductivity. AlN efficiently moves heat away from hot spots. This capability is vital for demanding electronic applications. High-power devices generate significant heat during operation. This heat must be removed quickly. Traditional materials often struggle. AlN handles this task superbly. Its thermal conductivity reaches 170-200 W/mK. This performance beats many common ceramics easily. Heat spreads rapidly across the AlN surface. This prevents dangerous local overheating. Component reliability improves significantly.

The substrate features thick printing technology. Conductor layers are applied using thick film methods. This process deposits conductive pastes onto the ceramic. The printed layers are notably thicker than thin film alternatives. This increased thickness provides crucial benefits. It allows for handling much higher electrical currents. Power density limits rise substantially. The thick conductors also enhance mechanical robustness. They resist damage better during handling and assembly. Connections become more durable overall.

Material purity is strictly controlled. High-grade Aluminum Nitride powder forms the base. Precise sintering creates a dense, uniform structure. This minimizes internal defects. Fewer defects mean better heat flow internally. The ceramic surface is extremely smooth. This smoothness is essential for precise printing. It ensures sharp, accurate conductor patterns. Electrical performance remains consistent. High insulation resistance is guaranteed. The substrate withstands high voltages safely. Its thermal expansion closely matches silicon. This compatibility reduces stress on mounted chips. Soldered joints stay reliable longer.

These properties combine powerfully. The AlN substrate excels where heat is the enemy. Power modules, RF amplifiers, and laser diodes benefit greatly. High-brightness LED systems also rely on such solutions. Devices run cooler. Lifespans extend. System failures decrease. Performance stays stable even under heavy loads. Engineers gain a dependable thermal management foundation.

Applications of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate

Aluminum Nitride ceramic substrates are special materials. They handle heat extremely well. This makes them perfect for many demanding jobs. Heat build-up ruins electronics. This material pulls heat away fast. That keeps things cool and working properly.

LED lighting needs these substrates. Powerful LEDs create intense heat. Good heat removal means brighter light and longer life. The light stays strong for years. Power electronics use them too. Things like high-power transistors and converters get very hot. Aluminum Nitride cools them effectively. This prevents breakdowns and allows smaller designs.

Telecom equipment relies on these substrates. Base stations and amplifiers need stable performance. Heat causes signal problems. Aluminum Nitride manages the heat. It ensures clear communication signals. Automotive electronics benefit greatly. Electric cars and hybrids have powerful systems. These systems generate lots of heat in tight spaces. Aluminum Nitride substrates keep critical parts like motor controllers cool. This improves safety and reliability on the road.

RF and microwave devices use them. Heat can distort signals. Aluminum Nitride provides excellent thermal management. It also works well electrically. This is vital for radar and satellite tech. Laser diodes also depend on this material. Lasers produce concentrated heat. Without quick heat removal, they fail quickly. Aluminum Nitride draws the heat out. This protects the laser and keeps it working.

The material is very strong electrically. It stops electricity from leaking. This is crucial for high-power circuits. It also lasts a long time. It resists wear and harsh conditions. Engineers choose it for tough jobs. It solves heat problems where other materials fail.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate

Here are 5 common questions about Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate:

What exactly is this Aluminum Nitride substrate? It’s a special ceramic board. It’s made mainly from aluminum nitride powder. This material is excellent at moving heat away. Circuits get printed onto its surface using a thick film method. This creates a solid base for powerful electronic parts needing serious cooling.

Why pick Aluminum Nitride over regular alumina ceramic? Aluminum Nitride moves heat much better. Think 5 to 10 times better than standard alumina. This is critical. Modern electronics pack huge power into tiny spaces. They generate intense heat. Aluminum Nitride pulls that heat away fast. This prevents overheating and damage. It keeps devices running reliably.

How is the circuit pattern put on the substrate? The thick film printing process applies it. A special paste gets screen-printed onto the ceramic surface. This paste contains conductive metals like silver or gold. Then the whole thing gets fired at high temperature. This bonds the circuit firmly to the Aluminum Nitride base. The result is a strong, integrated component ready for assembly.

Where is this substrate typically used? Find it inside demanding electronics. High-power LED lighting systems rely on it. Power converters and modules use it. RF and microwave devices need it. Electric vehicle power systems depend on it. Any application where intense heat builds up fast needs this material. It handles the heat other materials can’t manage.

Any special handling needed for this substrate? Yes, be careful. It’s a ceramic. It can break if dropped or hit hard. Avoid sharp impacts during installation. Use the right mounting methods. Follow the manufacturer’s instructions precisely. This ensures you get the best performance and avoid cracking the board.