Overview of High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics

High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics

Our high thermal conductivity aluminum nitride ceramic plates solve heat problems in tough electronics. Aluminum nitride material moves heat away fast. These substrates handle extreme conditions in power modules. They keep devices cool and reliable.

The thermal conductivity reaches 170 to 200 W/mK. This number is much higher than regular alumina ceramics. It matches or beats expensive beryllium oxide. Heat spreads quickly across the plate. Hot spots disappear. Components last longer.

These AlN plates are strong electrical insulators. Their dielectric strength is excellent. Voltage breakdown risks are low. Safety improves for high-power circuits. The material resists chemical attack well. Harsh environments are not a problem.

The thermal expansion fits silicon chips closely. CTE mismatch stress is reduced. Solder joints stay intact during temperature swings. Reliability increases significantly. Warping or cracking is less likely.

Standard plate thicknesses are available. Choices include 0.25mm, 0.38mm, 0.635mm, 1.0mm. Other sizes are possible. We offer custom dimensions. Tell us your needs. We can make it.

Surface finishes are critical. We provide smooth, flat surfaces ready for metal layers. Common options are polished or as-fired. Both sides can be finished the same. Fine surface quality aids circuit bonding. Thick film or thin film processes work well.

These substrates suit demanding power applications. Use them in IGBT modules, LED arrays, laser diode mounts, and high-frequency RF circuits. They handle intense heat from silicon carbide or gallium nitride devices. Thermal management becomes simpler.

Applications of High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics

Aluminum nitride ceramic plates offer excellent heat removal for power electronics. Heat buildup damages components. This material solves that problem well. Power devices generate significant heat during operation. Managing this heat is critical for reliability and performance. AlN ceramic plates move heat away fast. Their thermal conductivity is much higher than regular alumina ceramics. This property makes them perfect for demanding applications.

One major use is semiconductor packaging. Power chips like IGBTs and MOSFETs need efficient cooling. AlN substrates act as bases directly under the semiconductor die. They pull heat straight from the source. This prevents dangerous hot spots. It allows the chips to run cooler and handle more power safely. Device lifetimes improve significantly.

Another key area is power module substrates. Modern power modules pack many devices tightly. Effective thermal management is essential. AlN plates form the core insulating layer. They conduct heat downwards to the heatsink. This keeps the entire module temperature lower. Power density can increase without overheating risks. System size and weight often decrease too.

AlN plates also work well as heat spreaders. They attach directly to hot components. Heat spreads quickly across the large plate surface. This heat then transfers easily to attached cooling systems like fins or liquid cold plates. Hot spots disappear. Overall thermal resistance drops.

LED lighting benefits from AlN substrates. High-power LEDs create intense heat in small areas. AlN bases efficiently draw this heat away from the LED chip. This protects the LED from thermal damage. Light output stays stable and bright. Lifespan extends dramatically.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of High Thermal Conductivity Aln Ceramic Plate Aluminum Nitride Substrate for Power Electronics

What is aluminum nitride ceramic?
It’s a special ceramic material. Aluminum nitride handles heat extremely well. This ceramic moves heat away from hot spots fast. It keeps electronics cooler and working better.

Why does high thermal conductivity matter?
Electronic parts get very hot during operation. Too much heat damages components. It makes them fail sooner. Good heat spreading stops this. Aluminum nitride pulls heat away efficiently. This protects sensitive electronics.

Is aluminum nitride better than alumina ceramic?
Yes, for heat spreading it is much better. Alumina ceramic is common but moves heat slower. Aluminum nitride moves heat roughly eight times faster. Devices needing top cooling performance choose aluminum nitride.

Why use it for power electronics?
Power electronics like IGBTs and MOSFETs generate intense heat. Managing this heat is critical. Aluminum nitride substrates pull heat directly off these chips. They move the heat into cooling systems quickly. This prevents overheating and failure. It allows higher power in smaller devices.

Does it conduct electricity?
No, it does not. Aluminum nitride is an excellent electrical insulator. It blocks electric current completely. This is vital for safety and function. It moves heat fast while keeping circuits electrically separate.