Overview of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic is an advanced technical ceramic renowned for its exceptional thermal conductivity and reliable electrical insulation. It is a key material in high-power electronics, LED lighting, and semiconductor processing, effectively managing heat in demanding applications where performance and reliability are critical.

Features of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

• High Thermal Conductivity: Offers excellent heat dissipation, comparable to beryllia (BeO).
• Electrical Insulation: Maintains high electrical resistivity even at elevated temperatures.
• Low Thermal Expansion: Matches the coefficient of thermal expansion of silicon, ideal for semiconductor substrates.
• Excellent Mechanical Strength: Possesses good mechanical properties for structural integrity.
• High-Temperature Stability: Performs reliably in harsh environments and at high temperatures.
• Non-Toxic: A safe alternative to beryllium oxide (BeO) ceramics.

Specification of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

This product uses aluminum nitride ceramic. Aluminum nitride handles heat very well. It moves heat fast. This ceramic stops electricity passing through. This prevents short circuits. The material is also strong. It lasts a long time under tough conditions.

We add metal layers to the ceramic using AMB technology. AMB stands for Active Metal Brazing. This method bonds thick copper directly to the ceramic. The bond is very strong. The bond handles heat stress much better than older methods. AMB allows thicker copper layers. Thick copper carries high electrical currents easily. Thick copper also spreads heat efficiently. The copper layer is usually 0.3mm thick or more. This gives excellent power handling. The metal traces are precise. This precision supports complex circuit designs.

The copper surfaces get an OSP treatment. OSP means Organic Solderability Preservative. This coating protects the copper. It stops the copper from oxidizing. Oxidation makes surfaces hard to solder. OSP keeps the copper clean and ready for soldering. OSP is thin. It does not interfere with soldering. It provides good shelf life. The surfaces stay solderable for months. OSP is lead-free. It meets environmental standards. This coating is reliable for assembly.

Applications of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

Aluminum nitride ceramic substrates with metallization are special. AMB technology bonds copper directly to the AlN. This creates a strong connection. The copper layer conducts electricity very well. The aluminum nitride underneath handles heat extremely effectively. This combination is powerful.

Heat management is critical in electronics. Components like power modules and LEDs generate a lot of heat. Standard materials often struggle. Aluminum nitride excels here. Its thermal conductivity is much higher than alumina. Heat moves away from hot spots fast. This prevents overheating. Devices run cooler. Performance improves. Lifespan increases.

The metallized surface allows electrical connections. Components solder directly onto the copper layer. This is essential for building circuits. The AMB process ensures the metal sticks firmly. It survives high temperatures and thermal cycling. Connections stay reliable. The substrate doesn’t warp or crack easily.

OSP treatment adds another layer. It protects the copper surface before soldering. This coating prevents oxidation. Oxidation causes poor solder joints. OSP keeps the copper clean and ready. Soldering happens smoothly later. Strong electrical bonds form. This is vital for high-reliability uses.

These substrates are ideal for demanding situations. Power electronics need efficient heat spreading. RF and microwave devices require stable performance. High-power LED lighting demands effective thermal management. Automotive systems face harsh conditions. Aerospace applications need absolute reliability. Metallized AlN with AMB and OSP meets these needs.

It offers superior thermal performance. Electrical connections are robust. The OSP layer simplifies manufacturing. This technology supports advanced electronics. It enables smaller, more powerful designs. Devices operate reliably under stress. This makes it a key material for modern electronics pushing performance limits.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

What is Metallized AlN Substrate with AMB and OSP?
This is Aluminum Nitride ceramic. It has a metal layer bonded onto its surface. AMB technology bonds the metal. OSP treatment coats the metal layer. This makes it ready for soldering components.

Why use AMB technology?
AMB bonds metal very strongly to the AlN ceramic. This creates an excellent electrical connection. It also creates an excellent path for heat to move out. The bond handles high temperatures well. It stays reliable under tough conditions. Other methods might not bond as strongly.

What does the OSP treatment do?
OSP puts a thin, protective coating on the metal layer. This coating prevents oxidation. Oxidation makes soldering difficult. The OSP coating keeps the surface clean. This ensures solder sticks properly during assembly. It gives a good, reliable solder joint.

Where is this AlN substrate typically used?
Its main use is in high-power electronics needing serious cooling. Think power modules for electric cars or trains. Think high-brightness LED lighting systems. It’s also used in RF/microwave packages. Anywhere moving heat away fast is critical. Its electrical insulation is also very important.

How much heat can this substrate handle?
Aluminum Nitride itself handles extreme heat very well. It works fine continuously above 500°C. The AMB metal bond also handles high temperatures reliably. The OSP coating is for assembly only. It burns off cleanly during the soldering process. The final assembly handles the high operating temperatures.