Overview of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230 is an ultra-hard advanced ceramic, ranking as the third hardest material known after diamond and cubic boron nitride. Often referred to as “black diamond,” it is the premier choice for extreme applications requiring maximum hardness and lightweight properties, particularly in the field of ballistic armor and abrasive environments.

Features of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

• Exceptional Hardness: Possesses a hardness level near that of diamond, making it ideal for abrasive and wear-resistant applications.

• Extremely Lightweight: With a low density, it offers an outstanding strength-to-weight ratio, crucial for personal and aviation armor.

• Outstanding Ballistic Performance: The premier material for high-performance body and vehicle armor plates, capable of defeating high-velocity threats.

• High Neutron Absorption: An excellent neutron capture cross-section makes it a key material for nuclear reactor control rods and shielding.

• Excellent Chemical Resistance: Highly inert and resistant to acids and alkalis, ensuring performance in corrosive environments.

• High-Temperature Stability: Maintains its properties and structure at elevated temperatures.

Specification of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

This is Boron Carbide powder, grade F230. It’s very fine micron powder. This material is excellent for polishing hard surfaces. People use it especially for finishing high purity sapphire wafers. Sapphire wafers need super smooth surfaces. Boron Carbide helps achieve this. It’s known for being extremely hard. Only diamond is harder. This hardness makes it cut well. It removes material efficiently. The F230 grade means specific particle sizes. The particles are small and consistent. Consistency matters for even polishing. You avoid scratches this way. The powder is pure Boron Carbide, B4C. High purity is critical. Contaminants ruin delicate wafers. This powder ensures clean results. It polishes sapphire to precise specifications. Other uses exist too. It works for lapping hard ceramics. It polishes precision optical glass. It finishes tough metals. It’s a versatile abrasive. Its properties make it reliable. The fine grit gives fine finishes. You get the smoothness needed for electronics. Sapphire wafers are used in LEDs. They are used in semiconductor components. They are used in demanding applications. Surface perfection is non-negotiable. Boron Carbide F230 delivers that finish. It is a trusted choice for manufacturers. Quality control is strict. Particle size distribution is tight. Chemical purity is high. This guarantees performance batch after batch.

Applications of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Sapphire wafers are vital components. They are used in high-tech devices like LEDs, lasers, and semiconductor applications. These wafers require perfectly smooth and flat surfaces. Achieving this demands extremely precise polishing. Ordinary abrasives might not deliver the needed results. They could scratch the sapphire or leave imperfections. This is where high-purity Boron Carbide (B4C) micron powder comes in.

Boron Carbide powder, specifically grade F230, is an exceptional abrasive for this task. B4C is one of the hardest materials known. This extreme hardness allows it to effectively remove material from the sapphire surface. The F230 grade refers to its fine particle size. This fine size is crucial. It helps create the ultra-smooth finish sapphire wafers require.

Using B4C F230 powder offers several clear benefits. Its hardness ensures efficient material removal. This leads to faster polishing times. The high purity of the powder is critical. Impurities can cause defects on the wafer surface. High purity B4C minimizes this risk significantly. The consistent particle size (F230) ensures uniform polishing. This uniformity is essential for achieving wafer flatness specifications.

The result is a superior surface finish on the sapphire wafer. This high-quality finish is necessary for optimal device performance. Devices using these wafers will function more reliably. Manufacturers rely on B4C F230 powder. It helps them meet the strict quality demands of the electronics industry. This powder is a key tool for producing top-grade sapphire wafers.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

What is this boron carbide powder? It’s a super hard abrasive powder. People use it for polishing sapphire wafers. The powder particles are very small. They measure just a few microns. This small size gives a fine polish.

Why use boron carbide for sapphire wafers? Boron carbide is extremely hard. Only diamond is harder. This hardness cuts sapphire effectively. It polishes sapphire smoothly. The powder is very pure. High purity prevents scratches. It leaves a clean surface.

What does F230 mean? F230 is the grit size. It tells you the particle size. F230 is a fine grit. It is good for final polishing stages. Finer grits make smoother surfaces.

How do you use this powder? You mix it with a liquid. Oil or water works. This makes a polishing slurry. You apply the slurry to a polishing machine. The machine rubs the slurry on the wafer. The abrasive particles remove tiny bits of sapphire. This smoothes the surface. You control the pressure and speed. This controls the polishing result.

Where can you buy it? Special suppliers sell it. You need to find a supplier of fine abrasives. They provide high purity boron carbide powder. Ask for F230 grit size.