Overview of Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate

Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate is a high-performance advanced ceramic renowned for its exceptional combination of thermal shock resistance, high strength, toughness, and excellent wear and corrosion resistance. It is a material of choice for demanding applications across various industries, from automotive and aerospace to industrial and medical.

Features of Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate

l Excellent Thermal Shock Resistance: Withstands rapid temperature changes without cracking.

l High Strength & Hardness: Maintains mechanical properties at both room and elevated temperatures.

l Good Fracture Toughness: Superior to many other technical ceramics, providing better resistance to chipping and breakage.

l Low Density & Lightweight: Significantly lighter than steel and many metals.

l Wear & Corrosion Resistance: Ideal for components exposed to abrasive and corrosive environments.

l Electrical Insulation: Offers good dielectric properties.

 

Specification of Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate

This ceramic substrate uses silicon nitride. Silicon nitride is a special ceramic. It has good thermal conductivity. It has high strength too. The ceramic base is strong and reliable. A metal layer is added to the ceramic. Active Metal Brazing bonds the metal to the ceramic. AMB creates a strong connection. Gold plating covers the metal surface. Gold plating provides excellent conductivity. It protects against corrosion. It also helps with soldering. The gold layer is thin but effective. This substrate handles high heat well. It moves heat away efficiently. This is vital for electronics. It prevents components from overheating. The structure is very rigid. It does not bend easily. This supports delicate parts. Electrical insulation is another key feature. The ceramic blocks electricity flow. This prevents short circuits. The metal layer carries the current. Gold plating ensures low resistance. This means less energy loss. The surface is smooth and flat. Components attach cleanly. Solder joints form reliably. This substrate suits demanding applications. Power modules use it often. Electric vehicles need such materials. Renewable energy systems benefit too. High-power LEDs rely on it. RF devices find it useful. The combination offers high performance. It withstands tough operating conditions. Long-term reliability is a result. Engineers choose it for critical designs.

Applications of Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate

Au plated Amb Technology Si3N4 silicon nitride metallized ceramic substrates are crucial components in demanding electronics. These substrates are made from silicon nitride ceramic. Silicon nitride is an excellent material. It offers high thermal conductivity. This means it moves heat away from sensitive electronic parts very well. This prevents overheating. It also provides outstanding mechanical strength. It can withstand tough conditions. It resists wear and tear. The surface is plated with a thin layer of gold. Gold plating is key. It creates a superb surface for bonding. Manufacturers attach chips or other components directly onto this gold layer. They use soldering or wire bonding techniques. The gold ensures a strong, reliable electrical connection. It also protects the ceramic underneath.

These substrates are ideal for high-power applications. They handle intense heat and electrical loads without failing. One major use is in high-power LED lighting systems. LEDs generate significant heat. Efficient heat dissipation is vital. The silicon nitride substrate moves heat away from the LED chip. This keeps the LED cool. It extends the LED’s lifespan. It also maintains stable light output. Another key area is automotive electronics. Modern cars rely heavily on electronics. Engines and transmissions need precise sensors. These sensors operate in hot, harsh environments. Silicon nitride substrates support these sensors. They ensure reliable performance under the hood. The gold plating offers stable connections critical for sensor accuracy.

Aerospace and defense industries also use these substrates. Equipment in planes, satellites, or military hardware faces extreme conditions. These include wide temperature swings, intense vibrations, and radiation. Silicon nitride ceramics perform reliably here. Their strength and stability are essential. They form the base for circuits in radar systems, communication gear, and navigation units. The gold plating ensures dependable signal transmission. It minimizes electrical losses. Power modules for electric vehicles and industrial machines are another application. These modules control large amounts of electricity. They need substrates that insulate well but conduct heat efficiently. Silicon nitride with gold metallization fits this need perfectly. It supports high currents and dissipates heat effectively. This keeps power electronics running safely.

Company Profile

Tanki New Materials Co.Ltd. focus on the research and development, production and sales of ceramic products, serving the electronics, ceramics, chemical and other industries. Since its establishment in 2015, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Aerogel, Aluminum Nitride, Aluminum Oxide, Boron Carbide, Boron Nitride, Ceramic Crucible, Ceramic Fiber, Quartz Product, Refractory Material, Silicon Carbide, Silicon Nitride, ect. please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Au Plated Amb Technology Si3n4 Silicon Nitride Metallized Ceramic Substrate

This ceramic substrate has silicon nitride inside. Gold plating covers the metal layer on top. People call it Au Plated Amb Technology Si3N4. It’s for electronics needing tough materials. Here are common questions.

What is Au Plated Silicon Nitride? It’s a special ceramic base. Silicon nitride is the main material. A metal layer bonds to its surface. Gold plating covers that metal layer. The Amb Technology helps make it strong.

Why use gold plating? Gold protects the metal layer. Gold stops corrosion very well. Gold also helps solder stick. Gold makes electrical connections reliable. It’s good for high-power uses.

What does Amb Technology do? Amb Technology strengthens the bond. It makes the metal stick better to the ceramic. This prevents peeling or cracking. It handles big temperature changes well. The part lasts longer because of it.

Why choose silicon nitride? Silicon nitride is really strong. It handles high heat without breaking. It moves heat away quickly. Electricity doesn’t pass through it easily. It’s perfect for tough electronic jobs.

Where is this substrate used? It goes into power modules. You find it in high-brightness LEDs. It works well in car electronics. Aerospace systems use it too. Any place needing a tough, reliable base uses it.