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Aluminum nitride ceramic substrates are widely used in the market

2023-09-02 10:09:18  News

Overview of Aluminum Nitride

Aluminum nitride (a covalent bond compound) is a diamond-like nitride, hexagonal crystal system, wurtzite crystal structure, non-toxic, white, or off-white atomic crystal. The molecular formula of aluminum nitride is AlN. Aluminum nitride is metal treated and can replace aluminum oxide and tantalum oxide in a large number of electronic instruments. Aluminum nitride can be prepared by reducing aluminum oxide and carbon or by directly nitriding aluminum.

Aluminum nitride ceramic properties:

Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrates. Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high-temperature resistance, chemical resistance, high resistivity and low dielectric loss, and is an ideal large-scale integrated circuit heat sink substrate And packaging materials. Aluminum nitride has a high hardness, surpassing the traditional alumina, it is a new type of wear-resistant ceramic material.

Aluminum nitride ceramic substrates are widely used in the market

China's substrates have a long history of development, and the types of substrates are constantly increasing. Traditional substrates include fiber substrates, FR-4, aluminum substrates and copper substrates.

With the improvement and consummation of industrial demand, limited by the matching of heat dissipation and thermal expansion coefficient, when the traditional substrate performance is difficult to meet the new demand, people have to start looking for alternatives. In the process of seeking various needs, they will naturally compare Various substrates, the best choice.

As the best choice, aluminum nitride ceramic substrates using LAM technology (laser high-rate activation metallization) can make the metal layer more tightly bonded to the ceramic, and the bonding strength between the metal layer and the ceramic is high. The maximum value can reach 45 Pa (the strength of the ceramic sheet is greater than 1mm thick). The aluminum nitride substrate has a metal film layer, which has higher resistance and lower resistance, and the thickness of the conductive layer can be arbitrarily customized in the range of 1 μm to 1 mm.

Application of Aluminum Nitride Ceramics

Aluminum nitride ceramic substrates are widely used in the market. Due to their low-frequency loss and low dielectric constant, high-frequency circuits can be designed and assembled, and high-density assembly, line/pitch (L) can be performed. /S) The resolution can reach 20μm. Under the current trend of thinness and lightness, it is very conducive to short, thin and light devices.

Why are aluminum nitride ceramic substrates more expensive than other substrates?

Compared with traditional ceramic substrates, the thermal conductivity of aluminum-based substrates is 1-2 W/mk. Although the thermal conductivity of copper itself reaches 383.8 W/mK, the thermal conductivity of the insulating layer is only about 1.0 W/mK, which is better. 1.8W/m Aluminum nitride ceramic substrate has high thermal conductivity, the data is 170 to 230 W/mk

For example, the coefficient of thermal expansion (CTE). In the field of LED lighting, the average thermal conductivity of the mainstream substrate CTE is 14~17ppm/C, and the CTE of the silicon chip is 6ppm/C. In the case of the excessive temperature difference and rapid temperature changes, the PCB will expand more than the chip package. , Leading to desoldering problems. Under such troubles, the CTE of the aluminum nitride ceramic substrate is 4-5ppm/C, which is brighter and closer to the expansion rate of the chip, which can effectively avoid similar situations.

In addition, the aluminum nitride ceramic substrate does not contain organic components, and the copper layer does not contain an oxide layer, has a long service life, and can be used for a long time in a reducing atmosphere, and is suitable for aerospace equipment.

The production market for ceramic substrates is overseas. In recent years, in order to realize the localization of aluminum nitride ceramic substrates, the advantages of independent research and the increasing demand for aluminum nitride substrates in the domestic market, in order to lay a better foundation for technology research and development, therefore, it has occupied the first line of the industry Status, domestic PCB companies have also paid more attention to this. The advantages of aluminum nitride ceramic substrates are outstanding.

Aluminum nitride ceramic price

The price of aluminum nitride ceramics varies randomly with the production cost, transportation cost,international situation, exchange rate and the supply and demand relationship of the aluminum nitride ceramics market. Tanki New Materials Co. Ltd aims to help all industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemicals by providing a full set of customized services. If you are looking for minimum nitride ceramic materials, please feel free to contact me to get the latest price of aluminum nitride ceramics.

Aluminum Nitride Ceramic Supplier

As a global supplier of aluminum nitride ceramics, Tanki New Materials Co., Ltd. has extensive experience in the performance, application, and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials (including oxides, carbides, nitrides, single metals, etc.), high-purity targets, functional ceramics, and structural devices, and provides OEM services.

If you are looking for high-quality aluminum nitride ceramics Powder, please feel free to contact us and send an inquiry. ( sales@ozbo.com ).

Chemical Composition of Spherical Aluminum Nitride AlN Granule:
AlNNFeMnOCCaSiNi
99.5%≥32%0.040.0005≤0.420.02≤0.009≤0.0450.0002
Spherical Aluminum Nitride Properties
Other NamesSpherical Aluminium nitride, AlN granule
CAS No.24304-00-5
Compound FormulaAlN
Molecular Weight40.9882
AppearanceWhite to pale yellow powder
Melting Point2200 °C
Boiling Point2517 °C (dec.)
Density2.9 to 3.3 g/cm3
Solubility in H2ON/A
Electrical Resistivity10 to 12 10x Ω-m
Poisson's Ratio0.21 to 0.31
Specific Heat780 J/kg-K
Thermal Conductivity80 to 200 W/m-K
Thermal Expansion4.2 to 5.4 µm/m-K
Young's Modulus330 GPa
Exact Mass40.9846
Monoisotopic Mass40.9846
Spherical Aluminum Nitride Health & Safety Information
RemarksDanger
Hazard StatementsH314-H335
Hazard CodesXi
Risk Codes36/37/38
Safety Statements26-37/39
RTECS NumberN/A
Transport InformationN/A
WGK Germany3




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